Vapor phase bonding for RF microstrip line circuits

Details Vapor phase bonding for RF microstrip line circuits Vapor phase bonding for RF microstrip line circuits

1986-07-03

1987-01-27

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

29829, 2281802, 228212, 228240, 228242, 228218, 228 447, B23K 3102

Patent

active

046389385

ABSTRACT:
An improved vapor phase soldering process and apparatus are disclosed having particular application to electronic circuitry designed for operation at frequencies higher than 1 MHz. A printed circuit board having a defined circuit pattern on both sides is clamped between two parallel clamping fixtures, one having circuit matching characteristics for the specified PC board, and the fixture further having vents allowing vapor phase gas access to the PC board and soldering process waste gasses egress from the soldering area. This process and apparatus allows shortened soldering time, and improves performance characteristics of the PC board by improving the conduction characteristics of the defined circuit pattern.

REFERENCES:
patent: 3355078 (1967-11-01), Smith
patent: 3617682 (1971-11-01), Hall
patent: 3689985 (1972-09-01), Nier
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4463892 (1984-08-01), Cusack et al.
patent: 4512509 (1985-04-01), Ellis, Jr. et al.

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