Vapor deposition patterning method

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 99, 427272, 505 1, 505741, B05D 512, B05D 132

Patent

active

049524208

ABSTRACT:
An etchless patterning method for depositing material patterns upon substrates. The method involves providing substrate to be patterned, immobilizing a patterned physical mask upon a mask carrier, transferring the mask from the carrier to contact the substrate, immobilizing the mask upon the substrate while removing the mask carrier, exposing the masked substrate to vapor phase pattern material in a vacuum, reimmobilizing the mask upon the mask carrier and removing the mask from the substrate in a manner that allows the mask to remain immobilized on the mask carrier. The process is particularly well suited for the production of circuit boards or electronic applications.

REFERENCES:
patent: 4022928 (1977-05-01), Piwcyzk
patent: 4373470 (1983-02-01), Martin
Tzanavaras, G., "Hold-Down Technique for Metal Masks Using Permanent Magnets," IBM TDB, vol. 20, No. 1, Jun. 1977, p. 364.

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