Vapor deposition of H.sub.3 PO.sub.4 and formation of thin phosp

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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156605, 156603, 156DIG64, C30B 102

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active

043603939

ABSTRACT:
Provision for a source of phosphorus dopant on a silicon wafer, for the subsequent formation of an electrical p-n junction, by the vapor deposition, at atmospheric pressure, of phosphoric acid to form an essentially continuous film on a silicon wafer, said wafer being at room temperature, and the firing of said film to form a phosphorus oxide-silicate-glass layer which will not interfere with any antireflective layer deposited thereon.

REFERENCES:
patent: 3173802 (1965-03-01), Patel et al.
patent: 4206026 (1980-06-01), Briska et al.

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