Vapor deposition apparatus including orbital substrate holder

Details Vapor deposition apparatus including orbital substrate holder Vapor deposition apparatus including orbital substrate holder

1976-02-09

1976-10-19

Kaplan, Morris

Coating apparatus

With cutting, punching or tearing of work

Web or sheet work

118 53, 269 57, C23C 1308

Patent

active

039864782

ABSTRACT:
In a method of an apparatus for forming a conductive layer on a substrate wafer by evaporative, sputtering or other similar processes performed under a controlled environment, there are provided means for holding the wafer at the edge portions thereof with minimal holding contact, means orbiting rotating the wafer about a first axis which forms an acute angle relative to the major surfaces of the wafer while the processes for forming the layer is in progress so that the layer is formed uniformly, and means orbiting the wafer about a second axis which is substantially orthogonal to said first axis.

REFERENCES:
patent: 2351537 (1944-06-01), Osterberg et al.
patent: 2483443 (1949-10-01), Spence
patent: 2824029 (1958-02-01), Zinty
patent: 2997979 (1961-08-01), Tassara
patent: 3046157 (1962-07-01), Nyman
patent: 3643625 (1972-02-01), Mahl
patent: 3746571 (1973-07-01), Little, Jr.
patent: 3858547 (1975-01-01), Bergfelt
patent: 3889632 (1975-06-01), Brunner et al.

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