Vapor deposition apparatus and method

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

118 501, 118723, 204192N, 427 38, B05D 306

Patent

active

045115931

ABSTRACT:
A method and apparatus for vapor depositing node-free coatings on substrate surfaces, without altering the pre-coating substrate surface dimension, are disclosed. A gaseous plasma (50) is generated within an evacuated deposition chamber (20) from a source (40) of coating material. The plasma generation is preferably performed by electric arc vapor deposition techniques. Means, preferrably a shield (60), are disposed in the chamber to intercept a portion of the plasma stream and to define a shadow region (60') that is substantially void of plasma particles traveling in a line-of-sight path from the source (40). Substrate(s) (30) to be coated are placed within the shadow region and are coated by that portion of the plasma diffusing into the shadow region. The substrates may be biased to ionically attract plasma ions. The shield (60) can be heated by ion bombardment of the plasma and positioned to heat the substrates by radiation. The shield may be electrically biased to enhance the coating operation. Substrates of substantially differing masses and shapes can be simultaneously coated.

REFERENCES:
patent: 2378476 (1945-06-01), Guellich
patent: 3625848 (1971-12-01), Snaper
patent: 3677924 (1972-07-01), Cash et al.
patent: 3900585 (1975-08-01), Matsubara
patent: 4094764 (1978-06-01), Boucher et al.
patent: 4279216 (1981-07-01), Buhl et al.
patent: 4351855 (1982-09-01), Pinkhasov

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