Vapor deposition apparatus

Coating apparatus – With vacuum or fluid pressure chamber

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118 7, 118 491, 118 64, 118620, C23C 1310

Patent

active

040155587

ABSTRACT:
Multi-layer coating apparatus and system for coating a substrate having a coating chamber and means for advancing the substrate in a horizontal position through the coating chamber. The coating chamber is provided with means for depositing the coating on the bottom side of the substrate as it is advanced through the chamber. Means is provided for preventing one substrate from bumping into another and for providing a predetermined spacing from the substrates as they are advanced through the coating chamber.

REFERENCES:
patent: 2671034 (1954-03-01), Steinfeld
patent: 2975753 (1961-03-01), Hayes
patent: 2997979 (1961-08-01), Tassara
patent: 3294670 (1966-12-01), Charschan et al.
patent: 3469560 (1969-09-01), Bukkila et al.
patent: 3495724 (1970-02-01), Beckham et al.
patent: 3568632 (1971-03-01), Cawthon
IBM Technical Disclosure Bulletin, Barber, "Two Chamber Air-to-Vacuum Lock System", vol. 11, No. 7 (Dec. 1968) pp. 757, 758.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vapor deposition apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vapor deposition apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vapor deposition apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2261384

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.