Vapor deposition apparatus

Details Vapor deposition apparatus Vapor deposition apparatus

1990-02-02

1990-12-04

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

20419231, 204298, C23C 1650

Patent

active

049745441

ABSTRACT:
A vapor deposition apparatus includes a vacuum chamber into which an active gas, an inert gas or a mixture of the active gas and the inert gas, a reactor for converting a gaseous raw material into a gaseous thin-film forming substance, and a nozzle attached to the reactor so as to blow out the gaseous thin-film forming substance toward a substrate supported by a counter electrode. The nozzle is so adapted as to bring about a pressure difference between an interior space of the reactor and the vacuum chamber, which pressure difference causes the blown-out gaseous thin-film forming substance to be formed a cluster. The vapor deposition apparatus makes it possible to deposit a thin-film on a substrate having poor thermal stability and to form highly dense thin-film.

REFERENCES:
Bunshah, Deposition Technologies for Films and Coatings, Noyes Publications, Park Ridge, N.J., U.S.A. .COPYRGT.1982, p. 258.

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