Vapor deposited film by plasma CVD method

Stock material or miscellaneous articles – Composite – Of metal

Reexamination Certificate

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C428S034400, C428S034600, C428S034700, C428S035800, C428S035900, C428S036700, C428S036910, C428S457000

Reexamination Certificate



A vapor deposited film is formed on a base material surface by a plasma CVD method where an organic metal compound and an oxidizing gas are used as a reactive gas. The vapor deposited film has three sections of a base material side adhesive layer having 5% or more carbon, a barrier intermediate layer having less than 5% carbon, and a surface protection film having 5% or more carbon, by element concentration with respect to the total amount of three elements of a metal element (M), oxygen (O) and carbon (C) derived from the organic metal compound. The vapor deposited film has excellent adhesiveness to the base material, and has excellent resistance to water, especially to alkaline aqueous solutions, as well.

patent: 6117541 (2000-09-01), Frisk
patent: 2003/0044552 (2003-03-01), Komada
patent: 2004/0247948 (2004-12-01), Behle et al.
patent: 2006/0138099 (2006-06-01), Namiki et al.
patent: 2006/0264044 (2006-11-01), Kobayashi et al.
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patent: 2005-89859 (2005-04-01), None
patent: 03/014415 (2003-02-01), None
patent: 2004/033753 (2004-04-01), None
patent: 2004/087989 (2004-10-01), None


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