Vapor deposited film by plasma CVD method

Stock material or miscellaneous articles – Composite – Of metal

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S034400, C428S034600, C428S034700, C428S035800, C428S035900, C428S036700, C428S036910, C428S457000

Reexamination Certificate

active

07906217

ABSTRACT:
A vapor deposited film is formed on a base material surface by a plasma CVD method where an organic metal compound and an oxidizing gas are used as a reactive gas. The vapor deposited film has three sections of a base material side adhesive layer having 5% or more carbon, a barrier intermediate layer having less than 5% carbon, and a surface protection film having 5% or more carbon, by element concentration with respect to the total amount of three elements of a metal element (M), oxygen (O) and carbon (C) derived from the organic metal compound. The vapor deposited film has excellent adhesiveness to the base material, and has excellent resistance to water, especially to alkaline aqueous solutions, as well.

REFERENCES:
patent: 6117541 (2000-09-01), Frisk
patent: 2003/0044552 (2003-03-01), Komada
patent: 2004/0247948 (2004-12-01), Behle et al.
patent: 2006/0138099 (2006-06-01), Namiki et al.
patent: 2006/0264044 (2006-11-01), Kobayashi et al.
patent: 1 388 593 (2004-02-01), None
patent: 1 388 594 (2004-02-01), None
patent: 2003-53873 (2003-02-01), None
patent: 2005-89859 (2005-04-01), None
patent: 03/014415 (2003-02-01), None
patent: 2004/033753 (2004-04-01), None
patent: 2004/087989 (2004-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vapor deposited film by plasma CVD method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vapor deposited film by plasma CVD method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vapor deposited film by plasma CVD method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2712634

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.