Vapor deposited film by plasma CVD method

Details Vapor deposited film by plasma CVD method Vapor deposited film by plasma CVD method

2011-03-15

2011-03-15

Aughenbaugh, Walter B (Department: 1782)

Stock material or miscellaneous articles

Composite

Of metal

C428S034400, C428S034600, C428S034700, C428S035800, C428S035900, C428S036700, C428S036910, C428S457000

Reexamination Certificate

active

07906217

ABSTRACT:
A vapor deposited film is formed on a base material surface by a plasma CVD method where an organic metal compound and an oxidizing gas are used as a reactive gas. The vapor deposited film has three sections of a base material side adhesive layer having 5% or more carbon, a barrier intermediate layer having less than 5% carbon, and a surface protection film having 5% or more carbon, by element concentration with respect to the total amount of three elements of a metal element (M), oxygen (O) and carbon (C) derived from the organic metal compound. The vapor deposited film has excellent adhesiveness to the base material, and has excellent resistance to water, especially to alkaline aqueous solutions, as well.

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