Vapor cooling device for semiconductor device

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

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174 15R, 357 82, 336 58, 361385, H01L 2342

Patent

active

040277283

ABSTRACT:
A semiconductor device is immersed into a cooling medium in its liquid phase disposed in a vessel. The cooling medium changes to its vapor phase due to heat from the semiconductor device to enter a condenser located above the vessel. The cooling medium condensed in the condenser passes through a conduit connected to the lower portion of the vessel to be directly mixed with the liquid cooling medium within the vessel.

REFERENCES:
patent: 2083611 (1937-06-01), Marshall
patent: 2561738 (1951-07-01), Hill
patent: 2711882 (1955-06-01), Narbut
patent: 3614693 (1971-10-01), Frey
patent: 3818983 (1974-06-01), Grandia
patent: 3887759 (1975-06-01), Staub et al.
patent: 3906261 (1975-09-01), Ogura et al.

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