Vapor cooling device for semiconductor device

Heat exchange – With retainer for removable article – Including liquid heat exchange medium

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Details

165105, 174 15HP, 317100, 357 82, H01L 2346

Patent

active

039890996

ABSTRACT:
A plurality of semiconductor elements alternating in compressive contact relationship hollow heat dissipation blocks are disposed below a coolant reservoir filled with a condensible coolant in its liquid phase having a liquid surface. The hollow blocks are connected to the reservoir through respective connection tubes to be filled with the liquid coolant. A condenser is disposed above the reservoir. One auxiliary tube is disposed within each connection tube and has an upper open end located below the liquid surface and short of a point where a condensed coolant from the condenser flows into the reservoir and a lower end opening within the associated block.

REFERENCES:
patent: 3476175 (1969-11-01), Plevyak
patent: 3609991 (1971-10-01), Chu et al.
patent: 3633665 (1972-01-01), France et al.
patent: 3653433 (1972-04-01), Scharli
patent: 3741292 (1973-06-01), Aabalu et al.

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