Vapor cooling device for dissipating heat of semiconductor eleme

Details Vapor cooling device for dissipating heat of semiconductor eleme Vapor cooling device for dissipating heat of semiconductor eleme

1975-03-12

1977-04-26

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 82, 165 80, 174 15R, 165105, H01L 2334

Patent

active

040203999

ABSTRACT:
A plurality of semiconductor elements alternating with hollow heat dissipation blocks are connected together into a unitary structure by means of a fastening mechanism and disposed below a coolant reservoir. The hollow blocks are connected in fluid communication to the reservoir through individual connection tubes including respective bellows-shaped tube portions. A body of boilable liquid coolant is charged into the reservoir and fills both the connection tubes and hollow heat dissipation blocks. A condenser is disposed in fluid communication relationship with and above the reservoir. The condenser may be disposed within the reservoir.

REFERENCES:
patent: 3609991 (1971-10-01), Chu
patent: 3653433 (1972-04-01), Scharli
patent: 3834454 (1974-09-01), Gammel
patent: 3864607 (1975-02-01), Phillips

Affiliated with

Also associated with

Rating

Vapor cooling device for dissipating heat of semiconductor eleme does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vapor cooling device for dissipating heat of semiconductor eleme, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vapor cooling device for dissipating heat of semiconductor eleme will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2089652