Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
Patent
1975-01-30
1976-12-07
James, Andrew J.
Heat exchange
With valve or movable deflector for heat exchange fluid flow
With by-pass of heat exchanger or heat exchanger section
357 79, 357 81, 165 80, 165105, 317100, 174 16HS, H01L 2504, H01L 2342, H01L 2344, H01L 2346
Patent
active
039966046
ABSTRACT:
A vapor cooled semiconductor device which comprises an envelope having at least one aperture, at least one semiconductor element enclosed therein, an electrode contacting the semiconductor element and exposed across the aperture of the envelope, an expandable diaphragm disposed through an insulator between the electrode and the wall of the envelope to seal the gap therebetween, spherical spring plates disposed outside the envelope and arranged to support the semiconductor element through the electrode under pressure, and a liquid coolant enclosed in the closed envelope, with space provided therein, whereby the semiconductor element may be cooled by the latent heat of vaporization of the liquid coolant.
REFERENCES:
patent: 2886746 (1959-05-01), Saby
patent: 2958021 (1960-10-01), Cornelison
patent: 3654528 (1972-04-01), Barkan
patent: 3736474 (1973-05-01), Sias
patent: 3800190 (1974-03-01), Marek
IBM Technical Disclosure Bulletin, Micro-Electronic Package; by Bleher et al.; vol. 12, No. 5, Oct. 1969.
Kimura Yoshio
Mitsuoka Hiroshi
James Andrew J.
Mitsubishi Denki & Kabushiki Kaisha
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