Vapor cooled semiconductor device enclosed in an envelope having

Details Vapor cooled semiconductor device enclosed in an envelope having Vapor cooled semiconductor device enclosed in an envelope having

1974-10-10

1976-07-27

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 79, 165 80, 165105, 174 16HS, H01L 2504, H01L 2342, H01L 2344, H01L 2346

Patent

active

039720632

ABSTRACT:
A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is immersed into a cooling liquid boilable adjacent the operating temperature of the semiconductor element. A pressing plate fixed to the opposite side wall resiliently presses the closure block to apply a compressible contact force to the semiconductor element. The stack may be sandwiched between two closure blocks closing the opposite opening on the bilateral walls of the lower envelope portion and pressed toward each other by two spherical segment of resilient material arranged back-to-back. Alternatively the stack may be carried between the bilateral envelope walls through a resilient spherical segment.

REFERENCES:
patent: 2780757 (1957-02-01), Thornhill et al.
patent: 3307087 (1967-02-01), Rogers et al.
patent: 3649738 (1972-03-01), Andersson et al.
patent: 3654528 (1972-04-01), Barkan
patent: 3703668 (1972-11-01), Bylund et al.
patent: 3743893 (1973-07-01), Yamomoto
patent: 3826957 (1974-07-01), McLaughlin
patent: 3834454 (1974-09-01), Gammel et al.

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