Vapor-condensing, heat-transfer wall

Details Vapor-condensing, heat-transfer wall Vapor-condensing, heat-transfer wall

1977-07-12

1979-09-04

Richter, Sheldon Jay

Heat exchange

With coated, roughened or polished surface

165110, 165181, F28B 908, F28F 304, F28F 1318

Patent

active

041664981

ABSTRACT:
A condensing, a heat-transfer wall for liquefying vapor having a temperature higher than the wall by bringing the vapor in contact therewith. There are provided many parallel grooves in the basic surface of the heat-transfer wall, thereby defining ridge portions or build-up portions thereamong. These ridge portions have their tip portions tapered at sharp acute angle. Recessed or concave portions are provided in the tip portions of these ridge portions, and these recessed portions have their surfaces inclined to the basic surface of the heat-transfer wall. The width of the respective grooves ranges from 0.05 to 2.5 mm, and the depth thereof is not more than 10 mm. The thickness of the respective ridge portions ranges from 0.01 to 2.5 mm, and the height there of is not more than 10 mm. The depth of the recessed portions ranges from 0.02 to 0.8 times the depth of the grooves, and the pitch of recessed portion is not more than 2.0 mm. The width of the tip portions of the portions is 0.01 to 1.0 times the pitch of the recessed portions.

REFERENCES:
patent: 3217799 (1965-11-01), Rodgers
patent: 3487670 (1970-01-01), Ware
patent: 3496752 (1970-02-01), Kun et al.
patent: 3768290 (1973-10-01), Zatell
patent: 3866286 (1975-02-01), Pasternak
patent: 3906604 (1975-09-01), Kakizaki et al.
patent: 4040479 (1977-08-01), Campbell et al.
patent: 4059147 (1977-11-01), Thorne

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