Vapor bonding method

Details Vapor bonding method Vapor bonding method

1976-06-14

1977-05-10

Jones, Jr., James L.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228242, B23K 104

Patent

active

040223710

ABSTRACT:
Components, printed circuit board assemblies and the like to be interconnected by soldering are appropriately fluxed and placed in an atmosphere of a saturated vapor derived from a heat transfer liquid medium having a boiling point above the melting point of the solder. The heat transfer medium is chosen to have a solubility parameter compatible with the solubility parameter of the flux to eliminate the need for subsequent flux cleaning.
An alternate embodiment includes a fatty acid in the heat transfer medium, which under some circumstances can eliminate the need to apply flux to the assembly being soldered.

REFERENCES:
patent: 2842841 (1958-07-01), Schnable et al.
patent: 3436278 (1969-04-01), Poliak
patent: 3734791 (1973-05-01), Poliak
patent: 3904102 (1975-09-01), Chu et al.

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