Dispensing – Molten metal dispensing – Flow controllers or assists
Patent
1997-01-21
1998-10-13
Kastler, Scott
Dispensing
Molten metal dispensing
Flow controllers or assists
222591, B67D 110
Patent
active
058207724
ABSTRACT:
A solder pump includes a pump body having a solder reservoir and pump chamber formed therein in fluid communication with each other. A nozzle portion is provided in communication with the pump chamber for dispensing solder. A thin movable diaphragm is positioned adjacent the pump chamber and movable into the pump chamber for selectively pressurizing solder in the pump chamber for dispensing solder through the nozzle portion. A diaphragm clamp is secured to the body for supporting the diaphragm. The clamp includes an internal channel extending therein and enclosed by the diaphragm. The channel is provided in communication with a source of pressurized air for selectively forcing the diaphragm into the pump chamber. An adjustable stop is positioned within the pump chamber adjacent the diaphragm for limiting movement of the diaphragm into the pump chamber.
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Freitag Otto Wilhelm
Meranda Keith Wade
Stevenson Randy Claude
Ford Motor Company
Hodges Leslie C.
Kastler Scott
May Roger L.
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