Vacuum well process

Details Vacuum well process Vacuum well process

1989-11-16

1990-06-19

Ramsey, Kenneth J.

Metal fusion bonding

Process

Applying or distributing fused filler

427294, B23K 3102, H05K 334

Patent

active

049345559

ABSTRACT:
A system and process, including a combination of a solder well and a vacuum system wherein micro through holes are filled with solder. A PC board or the like is supported for contact with solder on one side and with a vacuum apparatus for the application of a vacuum to the other side so that solder is drawn into the through holes for establishing electrically conductive connections therethrough.

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Printed Wiring and Backplane Industry Forecast, Gnostic Concepts, Inc., pp. 6-1 through 6-14, 6-28 through 6-31, 7-9 and 7-10.

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