Vacuum processing apparatus and semiconductor manufacturing...

Details Vacuum processing apparatus and semiconductor manufacturing... Vacuum processing apparatus and semiconductor manufacturing...

2008-03-25

2008-03-25

Rodriguez, Saul (Department: 3652)

Material or article handling

Apparatus for moving material between zones having different...

C414S939000

Reexamination Certificate

active

11074719

ABSTRACT:
A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plurality of processing chambers for performing vacuum processing to the sample and a vacuum transfer means for transferring the sample. Both of the plan views of the cassette block and the vacuum processing block are nearly rectangular, and the width of the cassette block is designed larger than the width of the vacuum processing block, and the plan view of the vacuum processing apparatus is formed in an L-shape or a T-shape.

REFERENCES:
patent: 4341582 (1982-07-01), Kohman et al.
patent: 4643629 (1987-02-01), Takahashi
patent: 4861222 (1989-08-01), Mirkovich
patent: 4908095 (1990-03-01), Kagatsume
patent: 5019233 (1991-05-01), Blake
patent: 5024570 (1991-06-01), Kiriseko et al.
patent: 5139459 (1992-08-01), Takahashi
patent: 5217501 (1993-06-01), Fuse et al.
patent: 5256204 (1993-10-01), Wu
patent: 5286296 (1994-02-01), Sato
patent: 5314509 (1994-05-01), Kato et al.
patent: 5326316 (1994-07-01), Hashimoto
patent: 5336325 (1994-08-01), Devilbiss
patent: 5340261 (1994-08-01), Oosawa et al.
patent: 5349762 (1994-09-01), Kato et al.
patent: 5357115 (1994-10-01), Asakawa et al.
patent: 5364222 (1994-11-01), Akimoto
patent: 5376212 (1994-12-01), Saiki
patent: 5405230 (1995-04-01), Ono et al.
patent: 5417537 (1995-05-01), Miller
patent: 5425812 (1995-06-01), Tsutahara
patent: 5436848 (1995-07-01), Nishida
patent: 5444217 (1995-08-01), Moore
patent: 5445484 (1995-08-01), Kato et al.
patent: 5478195 (1995-12-01), Usami
patent: 5512320 (1996-04-01), Turner et al.
patent: 5527390 (1996-06-01), Ono et al.
patent: 5536128 (1996-07-01), Shimoyashiro
patent: 5548482 (1996-08-01), Hatauchi et al.
patent: 5570990 (1996-11-01), Bonora
patent: 5607009 (1997-03-01), Turner
patent: 5618227 (1997-04-01), Tsutsumi et al.
patent: 5672239 (1997-09-01), Deornellas
patent: 5695564 (1997-12-01), Imahashi
patent: 5740034 (1998-04-01), Saeki
patent: 5810935 (1998-09-01), Lee
patent: 5826129 (1998-10-01), Hasabe
patent: 5842824 (1998-12-01), Nishi
patent: 5855726 (1999-01-01), Soraoka
patent: 5868854 (1999-02-01), Kojima et al.
patent: 5905302 (1999-05-01), Lane
patent: 5934856 (1999-08-01), Asakawa et al.
patent: 5944940 (1999-08-01), Toshima
patent: 5950330 (1999-09-01), Kato et al.
patent: 6057662 (2000-05-01), McAndrew et al.
patent: 6069096 (2000-05-01), Nishihata et al.
patent: 6257827 (2001-07-01), Hendrickson et al.
patent: 6270306 (2001-08-01), Otwell et al.
patent: 6510365 (2003-01-01), Nishinakayama et al.
patent: 6537012 (2003-03-01), Kawahara et al.
patent: 6540869 (2003-04-01), Saeki et al.
patent: 6558100 (2003-05-01), Kawahara et al.
patent: 6558509 (2003-05-01), Kraus et al.
patent: 6672819 (2004-01-01), Soraoka et al.
patent: 6696367 (2004-02-01), Aggarwal et al.
patent: 6698944 (2004-03-01), Fujita
patent: 6698991 (2004-03-01), Bachrach et al.
patent: 6705828 (2004-03-01), Soraoka et al.
patent: 6729824 (2004-05-01), Lei et al.
patent: 6752579 (2004-06-01), Soraoka et al.
patent: 6802934 (2004-10-01), Saeki et al.
patent: 6852194 (2005-02-01), Matsushita et al.
patent: 6853872 (2005-02-01), Nishihata et al.
patent: 6875306 (2005-04-01), Tamura
patent: 6950721 (2005-09-01), Tashiro et al.
patent: 7025554 (2006-04-01), Ozawa et al.
patent: 7198448 (2007-04-01), Ozawa et al.
patent: 7244086 (2007-07-01), Ostermann et al.
patent: 2002/0006323 (2002-01-01), Yoshida et al.
patent: 2002/0134506 (2002-09-01), Franklin et al.
patent: 2002/0192056 (2002-12-01), Reimer et al.
patent: 2003/0031539 (2003-02-01), Nulman et al.
patent: 2003/0044742 (2003-03-01), Wang et al.
patent: 2004/0013499 (2004-01-01), Cho et al.
patent: 2004/0105737 (2004-06-01), Ozawa et al.
patent: 2004/0165973 (2004-08-01), Lee et al.
patent: 2004/0219001 (2004-11-01), Reimer et al.
patent: 2005/0095088 (2005-05-01), Kurita et al.
patent: 2005/0111938 (2005-05-01), van der Meulen
patent: 2005/0158153 (2005-07-01), Sundar et al.
patent: 2005/0163599 (2005-07-01), Park
patent: 2005/0220575 (2005-10-01), Oono et al.
patent: 2005/0220577 (2005-10-01), Iijima et al.
patent: 0502412 (1992-09-01), None
patent: 0644575 (1995-03-01), None
patent: 2056169 (1981-03-01), None
patent: 47-2971 (1972-02-01), None
patent: 55-141570 (1980-11-01), None
patent: 60-246635 (1985-12-01), None
patent: 63-369 (1988-01-01), None
patent: 63-133532 (1988-06-01), None
patent: 63-209702 (1988-08-01), None
patent: 01-64231 (1989-03-01), None
patent: 1-188926 (1989-07-01), None
patent: 1-225321 (1989-08-01), None
patent: 1-305533 (1989-12-01), None
patent: 2-234095 (1990-09-01), None
patent: 3-62660 (1991-03-01), None
patent: 4-71331 (1992-03-01), None
patent: 4-71692 (1992-03-01), None
patent: 04-298059 (1992-10-01), None
patent: 5-21466 (1993-01-01), None
patent: 5-136245 (1993-06-01), None
patent: 6-33627 (1994-02-01), None
patent: 6-53304 (1994-02-01), None
patent: 6-97260 (1994-04-01), None
patent: 6-155697 (1994-06-01), None
patent: 6-314729 (1994-11-01), None
patent: 6-314730 (1994-11-01), None
patent: 61-8153 (1996-01-01), None
patent: WO 9104213 (1991-04-01), None

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