Vacuum processing apparatus and method

Details Vacuum processing apparatus and method Vacuum processing apparatus and method

1997-03-10

1998-12-22

Beck, Shrive

Coating apparatus

Gas or vapor deposition

Multizone chamber

414786, 414217, 414935, 414939, 414941, 414222, 414937, 4147445, C23C 1654

Patent

active

058512969

ABSTRACT:
A vacuum processing apparatus includes a reaction chamber, a non-reaction chamber which is a load-lock chamber or a double load-lock chamber. A double arm is accommodated in the non-reaction chamber, and includes a first arm and a second arm for taking out a processed wafer from the reaction chamber and supplying an unprocessed wafer to the reaction chamber. Wafer elevating mechanisms are provided in the reaction chamber and the non-reaction chamber. The double arm and the wafer elevating mechanisms are driven by a single drive source. Also, a selective engagement mechanism is provided at the reaction chamber and at the non-reaction chamber for selectively engaging the driving source with any one of the wafer elevating mechanisms at the reaction chamber and the non-reaction chamber to drive the double arm and the wafer elevating mechanism at the selected chamber.

REFERENCES:
patent: 5083896 (1992-01-01), Uehara et al.
patent: 5407314 (1995-04-01), Kempf

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