Vacuum processing apparatus

Details Vacuum processing apparatus Vacuum processing apparatus

2011-02-15

2011-02-15

Cleveland, Michael (Department: 1712)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Reexamination Certificate

active

07887669

ABSTRACT:
The invention provides a plasma processing apparatus for processing a wafer mounted on a sample stage placed in a vacuum processing chamber using a plasma generated in the vacuum chamber. The plasma processing apparatus comprises a plate placed in the vacuum processing vessel above and opposed to the wafer, the plate having a through hole through which a first processing gas is introduced; a first and second cylindrical member arranged vertically and adjacently; and means communicating with the gap between the first and second cylindrical member for supplying a second processing gas. The wafer is processed while the first processing gas and the second processing gas having different compositions are supplied.

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patent: 62-290885 (1987-12-01), None
patent: 10-064881 (1998-03-01), None

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