Vacuum pick for semiconductor wafers

Details Vacuum pick for semiconductor wafers Vacuum pick for semiconductor wafers

1985-08-19

1986-11-04

Marbert, James B.

Handling: hand and hoist-line implements

Utilizing fluid pressure

Venturi effect

271 90, B66C 102

Patent

active

046207384

ABSTRACT:
A vacuum pick suitable for removing semiconductor wafers from and replacing wafers in a cassette holder. The vacuum pick includes a thin profile housing having a wafer support surface with a cavity therein, a resilient, flexible member covering a portion of the cavity to form an enclosure, and a rigid chuck mounted on the flexible member so as to permit movement of the chuck relative to the housing. The chuck includes a wafer-receiving surface connected through a passage to the enclosure. When a vacuum is applied to the enclosure, the wafer and the chuck are retracted against the housing and held firmly in place. The chuck tilts relative to the housing when it contacts a tilted wafer, thereby insuring reliable attachment to the wafer.

REFERENCES:
patent: 2850279 (1958-09-01), Stoothoff et al.
patent: 3158381 (1964-11-01), Yamamura
patent: 3484093 (1969-12-01), Mermelstein
patent: 3711081 (1973-01-01), Cachon
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patent: 4221356 (1980-09-01), Fortune
patent: 4294424 (1981-10-01), Teissier
patent: 4391511 (1983-07-01), Akiyama et al.
patent: 4493606 (1985-01-01), Foulke et al.
patent: 4496180 (1985-01-01), Hillman et al.
patent: 4506184 (1985-03-01), Siddall

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