Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Patent
1998-06-24
1999-12-28
Ramsey, Kenneth J.
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
445 70, H01J 940
Patent
active
060073977
ABSTRACT:
In the present invention, the vacuum packaging of a field emission display (FED) is achieved in a high vacuum apparatus using a glass-to-glass bonding. The apparatus may eliminate the problems encountered in the conventional art in which a ventilation tube is used, so that vacuum degree of the interior of panels of the FED is affected (decreased) by the gases generated in sealing the ventilation tube. Furthermore, in the prior art, a part of the ventilation tube remains on the panel of the FED for thereby increasing the thickness of the panels, and the ventilating of gases is not effectively performed by the extension of the tube and a big size hole. The vacuum packaging apparatus of the FED and method therefor according to the present invention are capable of more effectively packaging FED by implementing a glass-to-glass bonding by ventilating gases from the interior of the panel of the FED in a manner of a high temperature ventilation in a high vacuum apparatus, contacting a glass substrate piece with a hole formed in the panel of the FED and applying a DC voltage thereto. Therefore, it is possible to easily implement a vacuum packaging of the FED and vacuum degree of the interior of the FED panel may be increased.
REFERENCES:
patent: 5797780 (1998-08-01), Peng
On the Anistropically Etched Bonding Interface of Directly Bonded (100) Silicon Wafer Pairs, B.K. Ju, et al, J. Electrochem, Soc., vol. 142, No. 2., Feb. 1995, pp. 547-553.
Field Assisted Glass-Metal Sealing, George Wallis and Daniel Pomerantz, Journal of Applied Physics, vol. 40, No. 10., Sep., 1969, pp. 3946-3949.
Assembling three-dimensional microstructures using gold-silicon eutectic bonding, A.-L. Tiensuu, et al, Sensors and Actuators A 45 (1994) pp. 227-236.
Choi Woo Beom
Ju Byeong Kwon
Oh Myung Hwan
Korea Institute of Science and Technology
Ramsey Kenneth J.
LandOfFree
Vacuum packaging apparatus for a field emission display and a me does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Vacuum packaging apparatus for a field emission display and a me, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vacuum packaging apparatus for a field emission display and a me will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2378487