Vacuum package fabrication of integrated circuit components

Details Vacuum package fabrication of integrated circuit components Vacuum package fabrication of integrated circuit components

2006-03-21

2006-03-21

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S109000, C438S456000

Reexamination Certificate

active

07015074

ABSTRACT:
A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.

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PCT Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration mailed Sep. 15, 2004, regarding PCT/US 2004/012131 filed Apr. 19, 2004 (12 pages).

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