Vacuum microelectronic devices with multiple planar electrodes

Details Vacuum microelectronic devices with multiple planar electrodes Vacuum microelectronic devices with multiple planar electrodes

1996-01-16

1997-06-10

Breneman, R. Bruce

Semiconductor device manufacturing: process

Electron emitter manufacture

445 24, 445 50, 445 51, 438619, H01L 21461, H01J 900

Patent

active

056375395

ABSTRACT:
A fabrication process for vacuum microelectronic devices having multiple electrode levels includes production of a first-level electrode mask on a substrate. The mask pattern is transferred to the substrate to produce a trench surrounding an emitter which is formed by thermal oxidation. The trench is filled with tungsten to form a gate electrode surrounding the emitter, and the resulting wafer is planarized. A second-level electrode is formed on the top surface of the wafer, and is planarized. Additional levels are similarly produced, and thereafter the electrodes are released.

REFERENCES:
patent: 4008412 (1977-02-01), Yuito et al.
patent: 5186670 (1993-02-01), Doan et al.
patent: 5199917 (1993-04-01), MacDonald et al.
patent: 5201992 (1993-04-01), Marcus et al.
patent: 5316511 (1994-05-01), Lee
patent: 5394006 (1995-02-01), Liu
Chen, et al,"Surface Micromachined Multiple Level Tungsten Microstructures," Solid-State Sensor and Actuator Workshop Hilton Head, S.C. Jun. 13-16, 1994 pp. 99-102.
Macdonald et al, "Selective Chemical Vapor Deposition of Tungsten for Microelectromechanical Structures," Sensors and Actuators, 20 (1989) 123-133.
Brodie, et al, "Vacuum Microelectronics," Advances in Electronics and Electron Physics, vol. 83, 1992.
Busta, Heinz H., "Vacuum Microelectronics"--1992, J. Micromech. Microeng. 2 (1992) pp. 43-74.
Busta, et al, "The Field Emitter Triode as a Displacement/Pressure Sensor," M. Micromech. Microeng. 3 (1993) pp. 49-56.
Vaudaine, et al, "Microtips" Fluorescent Display, 1991 IEEE, pp. 8.1.1--8.1.4.
Greene et al, "Vacuum Integrated Circuits," IEDM 85, pp. 172-175, 1985.
Chang, et al, "A Scanning Tunneling Microscopes Based microcolumn System," Jpn.J.Appl.Phys.Vol. 31 (1992) Pt. 1, No. 12B, pp. 4232-4240.
Crewe, et al, "Micromachined Electrostatic Electron Source," J. Vac. Sci. Technol. B 10(6), Nov./Dec. 1992, pp. 2754-2758.
Spindt, et al, "Physical Properties of Thin-Film Field Emission Cathodes with molybdenum Cones," J. Appl. Phys. vol. 47, No. 12 Dec. 1976, pp. 5248-5263.

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