Vacuum infiltration of underfill material for flip-chip devices

Details Vacuum infiltration of underfill material for flip-chip devices Vacuum infiltration of underfill material for flip-chip devices

1991-12-23

1993-04-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156901, 174260, 428901, H05K 334

Patent

active

052030768

ABSTRACT:
A method of attaching an integrated circuit (10) to a substrate (20) starts with electrically interconnecting (14) the integrated circuit on the substrate. Next, a bead of underfill material (22) is provided on the substrate (20) about the periphery (24) of the integrated circuit (10). At least a partial vacuum (34) is then applied to the integrated circuit (10) and the substrate (20) to substantially evacuate the area (18) between the integrated circuit (10) and the substrate (20). Finally, fluid pressure (42) is applied to the integrated circuit (10) and the substrate (20) to force at least a portion of the underfill material (22) into the area (18) between the integrated circuit (10) and the substrate (20).

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 5019673 (1991-05-01), Juskey et al.
IBM Tech Disclosure Bull., vol. 23, No. 5, Oct. 1980, pp. 1877-1878.
IBM Tech Disclosure Bull., vol. 32, No. 10B, Mar. 1990, p. 480.
IBM Tech Disclosure Bull., vol. 29, No. 11, Apr. 1987, pp. 4718-4719.

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