Vacuum hermetic organic packaging carrier and sensor device...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S348000

Reexamination Certificate

active

07973454

ABSTRACT:
A vacuum hermetic organic packaging carrier and a sensor device package are provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

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