Vacuum handling apparatus

Handling: hand and hoist-line implements – Utilizing fluid pressure – Venturi effect

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Details

271 90, B66C 102

Patent

active

044961804

ABSTRACT:
A vacuum operated apparatus is provided for releasably grasping and transporting a thin solid object or article (e.g. silicon semiconductor wafer). The apparatus has two fixed rigid arms joined together at their rear end to define a gap therebetween having an open end and closed end wherein the upper arm directs the thin solid object into the gap and toward the lower arm having a port communicating with the gap and an enclosed passage way connected to a vacuum source. A vacuum applied to the lower arm holds the object against the grasping surface of the lower arm. Silicon semiconductor wafers may be grasped and transported with the apparatus and more especially silicon semiconductor wafers can be deposited onto and removed from the surface of a barrel type susceptor of an epitaxial reactor with enhanced ease and reduced danger of scratching and breaking the wafer.

REFERENCES:
patent: 1460314 (1923-06-01), Deck
patent: 1519243 (1924-12-01), Ericsson
patent: 1996385 (1935-04-01), Owen
patent: 2396988 (1946-03-01), Cutler
patent: 2807029 (1957-09-01), Armstrong
patent: 3539216 (1970-11-01), Forcier
patent: 3843183 (1974-10-01), Hutson
patent: 3997210 (1976-12-01), Jay
patent: 4002254 (1977-01-01), Olofsen
patent: 4050729 (1977-09-01), Hutson
IBM Technical Disclosure Bulletin, vol. 19, No. 11, Apr. 1977, pp. 4175-4176, "Unloading Tool for Wafers", Clark et al.
IBM Technical Disclosure Bulletin, vol. 24, No. 6, Nov. 1981, pp. 3017-3018, "Vacuum Wafer Pick-Up Tip", Ferrentino et al.

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