Glass manufacturing – Processes – Fusion bonding of glass to a formed part
Reexamination Certificate
1999-11-24
2001-10-16
Colaianni, Michael P. (Department: 1731)
Glass manufacturing
Processes
Fusion bonding of glass to a formed part
C065S040000, C065S110000, C156S089120, C156S104000, C156S285000, C156S286000, C428S001100, C428S034000, C204S451000, C204S601000, C356S344000, C349S191000
Reexamination Certificate
active
06301931
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is directed to fusion bonding of glass plates, particularly to vacuum fusion bonding of glass plates, and more particularly to an improved apparatus and method for void-free vacuum fusion bonding of glass plates within which are etched features, such as microstructure channels and ports.
Apparatus using a network of fluidic channels, such as microchannel arrays for chemical electrophoresis, involve the formation of the channels on one or both mating glass plates, for example, and the plates are bonded together, such as by fusion bonding. A common problem with fusion bonding is incomplete bonding of the areas, leaving thin, unbonded regions or voids. Even with the use of external force and pressure, voids are difficult to avoid. The concept of developing a partial vacuum between two substrates while maintaining an ambient or higher pressure outside the substrates has been used in mask aligners for some time, and this greatly enhances the area of close-contact. The concept of using vacuum and fusion was recently demonstrated on glass, and that process is described and claimed in U.S. application Ser. No. 09/067,022 filed Apr. 27, 1998, now U.S. Pat. No. 6,000,243 entitled “Vacuum Pull Down for an Enhanced Bonding Process,” assigned to the same assignee.
The present invention solves the problem of conveniently applying the vacuum force with an apparatus that is compatible with the high temperatures needed for glass fusion bonding and is potentially useful for very large substrates that are patterned with small features. The present invention eliminates intermediate bonding layers which tend to fill small features etched into the substrates. Thus the present invention provides an improved apparatus and method for vacuum fusion bonding of large, patterned glass plates, such as microstructure channels for chemical electrophoresis.
SUMMARY OF THE INVENTION
An object of the present invention is to provide vacuum fusion bonding of glass plates.
A further object of the invention is to provide an improved apparatus for vacuum fusion bonding.
A further object of the invention is to provide an improved method for vacuum fusion bonding.
Another object of the invention is to provide an improved apparatus and method for vacuum fusion bonding of large, patterned glass plates.
Another object of the invention is to provide an apparatus and method for vacuum fusion bonding of glass plates wherein one or more of the plates included etched features, such as microstructure channels for chemical electrophoresis.
Another object of the invention is to provide void-free bonding of patterned and etched glass plates to form microchannels embedded between the glass plates.
Another object of the invention is to provide vacuum fusion bonding of glass plates having etched channels therein to form, for example, microchannel arrays having straight lengths of about 50 cm with over 100 channels that are about 10-200 microns wide and about 20-75 microns deep.
Other objects and advantages of the present invention will become apparent from the following description and accompanying drawings. The invention broadly involves vacuum fusion bonding of glass plates. More specifically, the invention comprises an improved apparatus and method for vacuum fusion bonding of large, patterned glass plates. One or both plates are patterned with etched features such as microstructure channels and vacuum pumpout moat and ports. One plate has one or more small holes which extend therethrough for connection to the vacuum pumpout fixture. The apparatus and method produce a complete fusion bond (void-free) of seamless, full-strength quality throughout the length and width of the plates. Current use of the invention, for example, is for fabricating microchannel arrays for chemical electrophoresis. Also, the invention can be used in the fabrication of any apparatus using a network for microfluidic channels embedded between plates of glass or similar moderate melting point substrates having a gradual softening point curve, such as certain plastics and alloys. Also, the invention can be used for the assembly of glass-based substrates onto larger substrates; for example, for integrating flat panel display tiles onto larger display screen systems.
REFERENCES:
patent: 3040213 (1962-06-01), Byer et al.
patent: 4887804 (1989-12-01), Ohtsuka
patent: 4953287 (1990-09-01), West et al.
patent: 5217214 (1993-06-01), Takei
patent: 5858187 (1999-01-01), Ramsey et al.
patent: 5958165 (1999-09-01), Takeuchi et al.
patent: 6231707 (2001-05-01), Gupta et al.
Balch Joseph W.
Davidson James C.
Swierkowski Steve P.
Carnahan L. E.
Colaianni Michael P.
The Regents of the University of California
Thompson Alan H.
LandOfFree
Vacuum fusion bonded glass plates having microstructures... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Vacuum fusion bonded glass plates having microstructures..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vacuum fusion bonded glass plates having microstructures... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2550716