Vacuum fixing jig for semiconductor device

Details Vacuum fixing jig for semiconductor device Vacuum fixing jig for semiconductor device

2005-03-10

2009-08-11

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S743000, C438S033000, C269S021000

Reexamination Certificate

active

07571538

ABSTRACT:
The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame21, and a rubber film22arranged within the outer frame21and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film22increases, the wafer-fixing jig20deforms the rubber film and allows the tapes2and6arranged between the wafer1and the rubber film22A to be pushed toward the wafer1gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

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