Vacuum encapsulation for surface acoustic wave (SAW) devices

Details Vacuum encapsulation for surface acoustic wave (SAW) devices Vacuum encapsulation for surface acoustic wave (SAW) devices

1978-09-25

1980-07-15

Smith, Alfred E.

Wave transmission lines and networks

Coupling networks

Delay lines including elastic surface wave propagation means

310341, 333155, 333193, H03H 910, H03H 904, H03H 930

Patent

active

042131049

ABSTRACT:
A surface acoustic wave (SAW) device having a substrate of desired material is vacuum encapsulated in a structure fabricated from the same material as that comprising the substrate.

REFERENCES:
patent: 4047129 (1977-09-01), Ishiyama

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