Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1997-11-20
2000-04-04
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438106, 438121, H01L 2144, H01L 2148, H01L 2150
Patent
active
060460768
ABSTRACT:
A microelectronic assembly such as an assembly of a semiconductor chip and mounting substrate is encapsulated by applying an encapsulant to the assembly while maintaining the assembly under a subatmospheric pressure to minimize gas entrapment in the encapsulant. After the encapsulant flow around the assembly, a higher pressure is applied, causing collapse of any voids in the encapsulant. The encapsulant is then cured. The method is particularly useful with assemblies wherein a chip is spaced from the substrate so that the encapsulant flows between the chip and substrate.
REFERENCES:
patent: 3811183 (1974-05-01), Celling
patent: 4190855 (1980-02-01), Inoue
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4381602 (1983-05-01), McIver
patent: 4396936 (1983-08-01), McIver et al.
patent: 4816896 (1989-03-01), Owens
patent: 5120678 (1992-06-01), Moore et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5194930 (1993-03-01), Papathomas et al.
patent: 5203076 (1993-04-01), Banerji et al.
patent: 5249101 (1993-09-01), Frey et al.
patent: 5288944 (1994-02-01), Bronson et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5398863 (1995-03-01), Grube et al.
patent: 5477611 (1995-12-01), Sweis et al.
patent: 5483106 (1996-01-01), Echigo et al.
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5518964 (1996-05-01), Distefano et al.
patent: 5536909 (1996-07-01), DiStefano et al.
patent: 5563445 (1996-10-01), Iijima et al.
patent: 5565862 (1996-10-01), Papathomas et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5706174 (1998-01-01), DiStefano et al.
patent: 5817545 (1998-10-01), Wang et al.
patent: 5834339 (1998-11-01), DiStefano et al.
Bascom et al., "Air Entrapment in the Use of Structural Adhesive Films," J. Adhesion, 1972, vol. 4, pp. 193-209, .COPYRGT.1972 Gordon and Breach Science Publishers Ltd.
DiStefano Thomas H.
Mitchell Craig S.
Collins D. M.
Picardat Kevin M.
Tessera Inc.
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