Vacuum dispense apparatus for dispensing an encapsulant

Details Vacuum dispense apparatus for dispensing an encapsulant Vacuum dispense apparatus for dispensing an encapsulant

1999-01-08

2000-10-03

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

26427217, 425375, B29C 6700

Patent

active

061264288

ABSTRACT:
A microelectronic assembly such as an assembly of a semiconductor chip and mounting substrate is encapsulated by applying an encapsulant to the assembly while maintaining the assembly under a subatmospheric pressure to minimize gas entrapment in the encapsulant. After the encapsulant flow around the assembly, a higher pressure is applied, causing collapse of any voids in the encapsulant. The encapsulant is then cured. The apparatus used for such encapsulation may include a chamber and a dispenser having a nozzle disposed within the chamber, and may also include a device for moving the nozzle or the assembly relative to the chamber.

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