Vacuum deposition using pressurized reflow process

Details Vacuum deposition using pressurized reflow process Vacuum deposition using pressurized reflow process

1990-06-19

1991-04-30

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 67, 437 78, 437 79, H01L 2190

Patent

active

050117939

ABSTRACT:
A thin film forming method for a substrate having one or more recesses using a vacuum deposition wherein the thin film to be formed on the substrate is heated and melted, and the melted material of the thin film is pressurized and forced into each recess so as not to have any void in the thin film.

REFERENCES:
patent: 4920070 (1990-04-01), Mukai

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