Vacuum deposition methods and masking structure

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 53, 427154, 427248J, 427259, 427264, B05D 306

Patent

active

040229289

ABSTRACT:
A coating of a perfluoropolyether compound is applied to surfaces for inhibiting the deposition of a source material by evaporating or sputtering within a vacuum, and for the deposition of such material onto irregular surfaces, voids, or holes of an object. The coating can be applied by evaporating and then condensing the compound within a vacuum, or it can be applied as a fluid or thixotropic paste through direct contact by means such as a printing process. The coating can further be applied by spraying, or by spinning the surfaces about an axis with the fluid forming a thin coating through the action of centrifugal force. Selected portions of the coating can be removed so that the material is deposited in predetermined patterns. One method of removal is by dissolving the compound in a solvent. The coating can also be removed by selective evaporation in which a laser beam or an electron beam is directed across the surface. The beam evaporates the coating along a predetermined path whereby source material is subsequently condensed onto the substrate along this path. The vapor stream of material is reflected from surfaces coated with the compound so as to deposit onto surface portions of the object which are not in a line of sight with the source.

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