Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1979-04-11
1980-11-18
Newsome, John H.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
204192R, 204192C, 427 38, 427251, B05D 306
Patent
active
042346223
ABSTRACT:
Metallic coatings are vacuum deposited onto a substrate using more than one eposition method in a single vacuum deposition chamber without breaking vacuum between depositions by providing a vacuum deposition chamber with an RF sputter electrode, a chemical vapor deposition assembly spaced from the sputter electrode, and a substrate that can be rotated from beneath the RF sputter electrode to beneath the chemical vapor deposition assembly, then cleaning and degassing the substrate under vacuum in the deposition chamber, then positioning the substrate below the RF sputter electrode, backfilling the chamber with argon, and then sputter depositing a metal coating onto the substrate and then rotating the coated substrate to beneath the chemical vapor deposition assembly, vacuum pumping the chamber, delivering the material to be chemically vapor deposited to the substrate surface, and heating the substrate to the temperature required for the chemical vapor deposition reaction to take place.
REFERENCES:
patent: 2799600 (1957-07-01), Scott
patent: 3110620 (1963-11-01), Bertelsen
patent: 3485666 (1969-12-01), Sterling et al.
patent: 3879597 (1975-04-01), Bersin et al.
patent: 3991229 (1976-11-01), Fengler
patent: 4056642 (1977-11-01), Saxena et al.
patent: 4058638 (1977-11-01), Morton
Branovich Louis E.
Daly Edward
DuBuske Stanley
Hager Adolph G.
Newman Albert F.
Gibson Robert P.
Gordon Roy E.
Kanars Sheldon
Newsome John H.
The United States of American as represented by the Secretary of
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