Vacuum container for cryogenically cooled electron device packag

Refrigeration – Storage of solidified or liquified gas – Including cryostat

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622592, 250352, F25B 1900

Patent

active

049777483

ABSTRACT:
A vacuum package for electron devices operating at cryogenic temperatures provides a silicon-metal multilayer heatpath with lowest thermal impedance between electron device and cryogen, has a solid body for heat transfer to the external heat sink and a silicon carrier board as mounting cold station for electron device assemblies with high multifunction and integration complexity. For heat transfer component is joined to the package wall by a silicon-glass seal. The multilayer heatpath construction uses standard silicon technology and materials which are compatible with requirements for high vacuum integrity performance. A modular package construction flow chart results in high design flexibility, low cost and mass production capability.

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