Vacuum chuck with venturi jet for converting positive pressure t

Details Vacuum chuck with venturi jet for converting positive pressure t Vacuum chuck with venturi jet for converting positive pressure t

1994-03-28

1995-06-06

Bishop, Steven C.

Chucks or sockets

Vacuum

20429815, 269 21, B25B 1100

Patent

active

054215951

ABSTRACT:
A vacuum chuck (10) holds a semiconductor wafer (56) securely in place during manufacturing processes. An external chuck (12) has a hollow center portion receiving a spindle support (14) and shaft (16). A positive pressure is applied through the shaft to a nozzle assembly (26) that rests on the spindle support. The nozzle assembly is further housed within a cavity in an internal chuck (28) that rests within a cup in the external chuck. The nozzle assembly use a venturi jet (44) to convert the positive pressure to a vacuum. A plurality of vacuum ports (34 and 36) from the cavity of the internal chuck transfer the vacuum to an upper surface (40) of the internal chuck to hold the semiconductor wafer in place. A plurality of exhaust ports (30 and 32) from the cavity of the internal chuck exhaust gases radially across the upper surface (13) of the external chuck toward its perimeter to prevent undesired chemicals from reaching the underside of the semiconductor wafer.

REFERENCES:
patent: 4906011 (1990-03-01), Hiyamizu et al.

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