Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly
Patent
1997-02-10
1998-05-19
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Chamber enclosing work during bonding and/or assembly
269 21, B29C 6552
Patent
active
057530700
ABSTRACT:
A surface-mount ball-grid array package is provided for an integrated circuit assembly. The ball-grid array package has a circuit chip recess through which vias extend to open on a bottom surface of the package. A peripheral portion of the package is defined around the vias formed in the recess, and an integrated circuit die is seated within this peripheral portion. During manufacture, the package is held on a vacuum chuck by applying vacuum to the peripheral portion of the package. An adhesive material is placed in the recess to extend partially through the vias. The circuit chip is thereafter disposed in the recess on the adhesive material to complete the fabrication process. Ambient air is communicated to the vias on the bottom surface of the package to prevent the adhesive from being pulled through the vias by the applied vacuum.
REFERENCES:
patent: 2366935 (1945-01-01), Schmid
patent: 4521995 (1985-06-01), Sekiya
patent: 4603466 (1986-08-01), Morley
patent: 4693036 (1987-09-01), Mori
patent: 5118458 (1992-06-01), Nishihara et al.
Lorin Francis J.
LSI Logic Corporation
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