Vacuum chuck apparatus for wet processing wafers

Details Vacuum chuck apparatus for wet processing wafers Vacuum chuck apparatus for wet processing wafers

1988-10-17

1989-08-22

Nozick, Bernard

Handling: hand and hoist-line implements

Utilizing fluid pressure

Venturi effect

55158, 901 40, 414437, A47B 9700

Patent

active

048589756

ABSTRACT:
A vacuum chuck apparatus operable in both gas and liquid includes a liquid-gas separating membrane which allows passage of gas molecules but prevents passage of liquid. The liquid-gas separating membrane is disposed between an inlet hole of the chuck and a manifold which is connected to a pneumatic system. The pneumatic system includes an aspirator, a compressor and a switching valve. The vacuum chuck is immersed into a liquid, compressed gas purges the liquid in the inlet hole, then the switching valve is switched to the aspirator. An object, such as a semiconductor wafer, is vacuumed quickly to the chuck, and the inlet hole is closed by the object. If a small quantity of liquid intrudes into the chuck, it is stopped by the liquid-gas separating membrane.

REFERENCES:
patent: 2812061 (1957-11-01), Pfister

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