Vacuum braking system for semiconductor wafers

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193 40, 226 95, 226 97, 226195, 271195, 271229, 302 31, B65G 5102, B65G 5358

Patent

active

039763293

ABSTRACT:
An improved braking system comprising inlets imbedded flush with an air track surface with the elongated portions thereof parallel to the direction of wafer travel. The inlets are connected to a controlled vacuum source preferably by means of pressure regulating passageways communicating with both ends of each inlet. When vacuum is applied to the inlets, a traveling wafer passing over and substantially covering the elongated inlets is pulled uniformly and evenly down by vacuum action, so that substantially the entire bottom surface of the wafer contacts the track simultaneously. Thus, the wafer comes to rest at a single position within the braking station, irrespective of the original direction of wafer travel.

REFERENCES:
patent: 3293414 (1966-12-01), Barcia
patent: 3588176 (1971-06-01), Byrne et al.
patent: 3603646 (1971-09-01), Leoff
patent: 3717381 (1973-02-01), Hagler
patent: 3718371 (1973-02-01), Lasch

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