Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-08-04
2000-08-22
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156382, 156 87, 428105, 428106, 428107, 428114, B32B 3100
Patent
active
061066559
DESCRIPTION:
BRIEF SUMMARY
DESCRIPTION
The invention relates to a lamellar wood panel, in particular a lamellar boards panel, further to a method for making a lamellar wood panel, in particular a lamellar boards panel.
Several wood lamellas, i.e. layers, are stacked on each other and bonded together to make lamellar wood panels. Depending on the cement used, most of the time it is necessary to keep the bonding joint, the space between the individual wood layers, as thin a possible to assure reliable and load-resistant bonding. As a rule, comparatively high compressions are required and applied by mechanical presses of clamping means such as screw clamps or the like to ensure the cement is uniformly distributed between the wood layers. Cement extruding at the edges of the bonding joint tells the expert the cement is being spread uniformly.
A new manufacturing procedure proposed in the non-prepublished German patent application P 44 27 365. 7 is advantageous especially on economic grounds as regards to large-format lamellar wood panels. In this procedure, the stacked wood layers are covered by an airtight foil wrap which is part of a tightly sealable enclosure, and said enclosure is evacuated at least during part of the cement setting period. Exploiting the ambient air pressure, this procedure eliminates the need for complex and costly presses. However, this procedure incurs the drawback that the most compression achieved to cement the wood layers at best equals atmospheric pressure unless further means are employed. As a result, the applied compression may be inadequate to uniformly spread the cement and form an adequately thin bonding joint.
Accordingly, it is the objective of the invention to create a lamellar wood panel of the above kind wherein the cement distribution is optimized.
Another objective of the invention is to offer a method of the kind described to manufacture such a lamellar wood panel which can be implemented using simple means.
The invention assumes a lamellar wood panel comprising a plurality of wood layers superposed flat on each other and bonded at contacting large faces over their surfaces, in particular over their full surfaces, with some of the contacting wood layers in mutually transverse directions, specifically in mutually perpendicular fiber directions.
At least part of the contacting and mutually bonded large faces in a lamellar wood panel are fitted each with a plurality of substantially parallel slots running essentially in the fiber direction in such manner that some of the slots on contacting wood layers with mutually transverse fiber directions cross the slots on the contacting wood layer.
The invention is based on the concept that cavities are subtended at the slots' crossing sites between the bonded wood layers, said slots acting as cement reservoirs during compression and thereby promoting uniform and laterally omnidirectional cement distribution. Because of the plurality of crossing sites distributed in the area of the bonding joint and the ensuing reservoirs, local cement accumulations during compression are precluded, and the enlargement of the bonding joint at such sites is similarly controlled.
Accordingly, a lamellar wood panel of this design is suitable for manufacturing procedures employing only modest compressions, in particular the above outlined vacuum cementing.
Bonding wood layers with equally thin bonds furthermore offers the advantage of saving cement and permits the use of more economic cements.
Because of its inherent properties, the lamellar board panel can be advantageously used as a wall component because it offers a high tightness to air, combined with a relatively low vapor diffusion impedance. The latter property is the consequence of high moisture transport rates along the intersecting slots such that humidity in the panel will quickly spread. This property is also caused by the increased ability for cross-panel diffusion, especially if the slots are fairly deep.
In regions undergoing comparatively large shear stresses, for instance where panels are stored, locally relat
REFERENCES:
patent: 2307985 (1943-01-01), Beasecker
patent: 2661511 (1953-12-01), Weyerhaeuser
International Publication No. WO 95/32082 published Nov. 30, 1995.
Lorin Francis J.
Moser Karl
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