Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1997-10-27
1999-12-07
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438118, 438124, H01L 2144
Patent
active
05998242&
ABSTRACT:
A semiconductor chip fabrication assembly and method including a semiconductor package having a packaging substrate and a semiconductor die. An active circuit surface of the semiconductor die is positioned adjacent to a contact surface of the packaging substrate such that a substantially thin gap is formed therebetween. A semi-rigid shroud device is provided which defines a vacuum chamber configured to extend around the gap to hermetically seal the gap within the vacuum chamber. A dispensing device is provided having an outlet end positioned proximate the gap in the vacuum chamber which is adapted to vacuum flow the bonding material between the electrical contacts in the gap, and between the active circuit surface and the contact surface. The absence of air and any other gases forms a substantially voidless underfill layer of bonding material in the gap.
REFERENCES:
patent: 5663106 (1997-09-01), Karavakis et al.
patent: 5817542 (1998-10-01), Sakeml
patent: 5817545 (1998-10-01), Wang et al.
patent: 5866442 (1999-02-01), Brand
"Breakthrough Vacuum Dispensing for Micro BGA Underfill", CAM/ALOT Liquid Dispensing Systems Catalog, p. 2. No Date.
"CAM/ALOT 3900 Vacuum Dispensing System", CAM/ALOT Liquid Dispensing Systems, Product Release No. 106 No Date.
Kirkpatrick Galen C.
Murphy Stephen A.
Patel Sunil A.
Thavarajah Manickam
LSI Logic Corporation
Picardat Kevin M.
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