Vacuum assisted resin transfer method for co-bonding...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S285000, C264S257000, C264S259000, C264S263000, C244S177000, C244S126000

Reexamination Certificate

active

07138028

ABSTRACT:
A method for forming complexly shaped composite laminate assemblies. A pair of dry fiber preforms are placed on a tool with a thin film adhesive layer therebetween. A vacuum bag encloses the preforms and the adhesive layer. The preforms are heated to a temperature sufficient to cause the adhesive to become viscous and to wet several plys of each of the preforms. The preforms are then allowed to cool slightly before resin is infused via a vacuum source through each of the preforms to thoroughly wet each of the preforms. The resulting joint formed at the bond line of the two preforms is stronger than what would be formed simply by adhering two otherwise completely formed preforms together because the dry fiber preforms, in connection with the heating of the preforms, allow wetting of several plys of each of the preforms at the joint area, rather than just the surface ply of each preform.

REFERENCES:
patent: 4470862 (1984-09-01), More et al.
patent: 4560428 (1985-12-01), Sherrick et al.
patent: 4622091 (1986-11-01), Letterman
patent: 4695344 (1987-09-01), Crane et al.
patent: 4786343 (1988-11-01), Hertzberg
patent: 4902215 (1990-02-01), Seemann, III
patent: 4942013 (1990-07-01), Palmer et al.
patent: 4966802 (1990-10-01), Hertzberg
patent: 4988469 (1991-01-01), Reavely et al.
patent: 5061542 (1991-10-01), Brace
patent: 5080851 (1992-01-01), Flonc et al.
patent: 5300360 (1994-04-01), Kocsis et al.
patent: 5403537 (1995-04-01), Seal et al.
patent: 5567499 (1996-10-01), Cundiff et al.
patent: 5840238 (1998-11-01), Setiabudi et al.
patent: 5851336 (1998-12-01), Cundiff et al.
patent: 5939013 (1999-08-01), Han et al.
patent: 5981023 (1999-11-01), Tozuka et al.
patent: 6555045 (2003-04-01), McClure et al.
patent: 2002/0022422 (2002-02-01), Waldrop, III et al.
patent: 2003/0019567 (2003-01-01), Burpo et al.
patent: 2003/0090025 (2003-05-01), Nelson et al.
patent: 2 225 277 (1990-05-01), None
U.S. Appl. No. 10/655,257, filed Sep. 4, 2003, Alberts et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vacuum assisted resin transfer method for co-bonding... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vacuum assisted resin transfer method for co-bonding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vacuum assisted resin transfer method for co-bonding... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3623729

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.