Vacuum airtight envelope and method for manufacturing same

Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly

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H01J 918

Patent

active

058204342

ABSTRACT:
A vacuum airtight envelope capable of being manufactured in bulk and with increased yields. Cathode substrates and anode substrates are prepared by multisubstrate co-formation techniques. A cathode source plate is cut into a plurality of individual cathode substrates, which are mounted on an anode source plate by surface-mounting. Then, getter boxes are temporarily fixed on the anode source plate and then sealedly joined thereto together with cathode substrates. Then, the anode source plate is cut, to thereby provide individual envelopes, which are then evacuated to a vacuum.

REFERENCES:
patent: 3931436 (1976-01-01), Kupsky
patent: 4071287 (1978-01-01), Sherk
patent: 4906311 (1990-03-01), Guroi

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