UV light sensitive die-pac for securing semiconductor dice durin

Details UV light sensitive die-pac for securing semiconductor dice durin UV light sensitive die-pac for securing semiconductor dice durin

1996-06-06

1998-07-07

Gehman, Bryon P.

Special receptacle or package

Holder for a removable electrical component

Including component positioning means

706460, 706701, B65D 8530, B65D 7300

Patent

active

057755108

ABSTRACT:
A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultraviolet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.

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