UV-hardenable and thermally hardenable epoxy resins for underfil

Details UV-hardenable and thermally hardenable epoxy resins for underfil UV-hardenable and thermally hardenable epoxy resins for underfil

1997-09-19

2000-03-14

Seidleck, James J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428206, 427386, 427558, 427559, 4273855, 427 96, 156 48, 174260, 174256, 522 83, 522148, 522170, B05D 512, B35B 300, H05K 103, C08F 246

Patent

active

060370432

ABSTRACT:
UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 .mu.m and a siloxane component are provided in addition to the casting resin formulation.

REFERENCES:
patent: 4141055 (1979-02-01), Berry et al.
patent: 4518631 (1985-05-01), Antonen
patent: 4590224 (1986-05-01), Frisch et al.
patent: 4842800 (1989-06-01), Walles et al.
patent: 5095053 (1992-03-01), Walles et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5242715 (1993-09-01), Schoen et al.
patent: 5248710 (1993-09-01), Shiobara et al.
patent: 5326589 (1994-07-01), Okinoshima et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5677045 (1997-10-01), Nagai et al.

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