UV-curable pressure-sensitive adhesive composition and its...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

Reexamination Certificate

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C522S064000, C522S126000, C438S464000

Reexamination Certificate

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06841587

ABSTRACT:
Provided are a UV-curable pressure-sensitive adhesive composition comprising a photoinitiator which has a molar absorptivity at 365 nm of at least 1,000 mol−1·cm−1and the maximum absorption wavelength of at least 420 nm on a long wavelength side; and an adhesive sheet having a layer of the composition disposed over a photo-transmitting base film. The pressure-sensitive adhesive sheet according to the invention can be cured even by exposure to ultraviolet rays at a low intensity or for short time so that it can contribute to energy saving and productivity improvement as a sheet for processing, fixation or surface protection of a semiconductor wafer.

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Machine translation of JP A-10-130591, May 1998, Japanese Patent Office website.
XP-002255955 (1993) Patent Abstracts of Japan Abstract of JP 04366112.
European Search Report dated Oct. 13, 2003.

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