Utilizing polysilicon diffusion sources and special masking tech

Metal treatment – Compositions – Heat treating

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29577R, 29579, 29591, 148174, 148175, 148187, 148188, 156643, 156644, 156653, 156657, 156659, 357 20, 357 34, 357 54, 357 59, 357 91, 427 85, 427 86, 427 88, H01L 21225, H01L 21285

Patent

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041572696

ABSTRACT:
A method consisting of a sequence of process steps for fabricating a bipolar transistor having base contacts formed of polysilicon material and an emitter contact formed of polysilicon material or metal. The emitter contact is self-aligned to the base contacts by the use of process steps wherein a single mask aperture is used for defining the base contacts and the emitter.

REFERENCES:
patent: 3460007 (1969-08-01), Scott
patent: 3719535 (1973-03-01), Zoroglu
patent: 3837935 (1974-09-01), Maeda et al.
patent: 3904450 (1975-09-01), Evans et al.
patent: 3915767 (1975-10-01), Welliver
patent: 4006046 (1977-02-01), Pravin
patent: 4013489 (1977-03-01), Oldham
patent: 4060427 (1977-11-01), Barile et al.
patent: 4074304 (1978-02-01), Shiba

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