Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material
Reexamination Certificate
2005-07-19
2005-07-19
Thompson, Craig A. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Bulk effect device
Bulk effect switching in amorphous material
C257S005000
Reexamination Certificate
active
06919578
ABSTRACT:
In an aspect, an apparatus is provided that sets and reprograms the state of programmable devices. In an aspect, a method is provided such that an opening is formed through a dielectric exposing a contact, the contact formed on a substrate. An electrode is conformally deposited on a wall of the dielectric, utilizing atomic layer deposition (ALD). A programmable material is formed on the electrode and a conductor is formed to the programmable material. In an aspect, a barrier is conformally deposited utilizing ALD, between the electrode and the programmable material.
REFERENCES:
patent: 4268908 (1981-05-01), Logue et al.
patent: 6203613 (2001-03-01), Gates et al.
patent: 6404665 (2002-06-01), Lowrey et al.
patent: 6511867 (2003-01-01), Lowrey et al.
patent: 6597009 (2003-07-01), Wicker
patent: 6621095 (2003-09-01), Chiang et al.
patent: 2002/0038883 (2002-04-01), Lowrey et al.
patent: 2003/0003634 (2003-01-01), Lowrey et al.
patent: WO 01/29893 (2001-04-01), None
patent: WO 02/09206 (2002-01-01), None
Hwang, Y.N., Hong, J.S., Lee, S.H., Ahn, S.J., Jeong, G.T., Koh, G.H., Kim, H.J., Jeong, W.C., Lee, S.Y., Park, J.H., Ryoo, K.C., Horii, H., Ha, Y.H., Yi, J.H., Cho, W.Y., Kim, Y.T., Lee, K.H., Joo, S.H., Park, S.O., Jeong, U.I., Jeong, H.S. and Kim, Kinam, “Completely CMOS-Compatible Phase-Change Nonvolatile RAM Using NMOS Cell Transistors,” presented at 2003 19thIEEE Non-Volatile Semiconductor Memory Workshop, Monterey, California, Feb. 26-20, 2003.
Ha, Y.H., Yi, J.H., Horii, H., Park, J.H., Joo, S.H., Park, S.O., Chung, U-In and Moon, J.T., “An Edge Contact Type Cell for Phase Change RAM Featuring Very Low Power Consumption,” presented at IEEE 2003 Symposium on VLSI Technology, Kyoto, Japan, Jun. 12-14, 2003.
Hwang, Y.N., Hong, J.S., Lee, S.H., Ahn, S.J., Jeong, G.T., Koh, G.H., Oh, J.H., Kim, H.J., Jeong, W.C., Lee, S.Y., Park, J.H., Ryoo, K.C., Horii, H., Ha, Y.H., Yi, J.H., Cho, W.Y., Kim, Y.T., Lee, K.H., Joo, S.H., Park, S.O., Chung, U.I., Jeong, H.S. and Kim, Kinam, “Full Integration and Reliability Evaluation of Phase-change RAM Based on 0.24 mm-CMOS Technologies,” presented at IEEE 2003 Symposium on VLSI Technology, Kyoto, Japan, Jun. 12-14, 2003.
Horii, H., Yi, J.H., Park, J.H., Ha, Y.H., Baek, I.G., Park, S.O., Hwang, Y.N., Lee, S.H., Kim, Y.T., Lee, K.H., Chung, U-In and Moon, J.T., “A Novel Cell Technology Using N-doped GeSbTe Films for Phase Change RAM,” presented at IEEE 2003 Symposium on VLSI Technology, Kyoto, Japan, Jun. 12-14, 2003.
Min et al.,Atomic Layer Deposition of TiN Thin Films By Sequential Introduction of Ti Precursor and NH3, Advanced Interconnects & Contact Materials & Processes For Future Integrated Circuits. Symposium, San Francisco, CA, Apr. 13-16, 1998, pp. 337-342.
J.M. McKenzie,Microcomputer Fundamentals, Western Electric Engineer, vol. 21, No. 3, Jul. 1977, pp. 3-13.
R.J. Zingg, et al.,A Terminal Multiplexor Application of Ovonic Memories, IEEE Transactions on Electron Devices, vol. ED-20, No. 2, Feb. 1973, pp. 188-194.
Dennison Charles H.
Lowrey Tyler A.
Ovonyx, Inc
Thompson Craig A.
Trop Pruner & Hu P.C.
Vesperman William
LandOfFree
Utilizing atomic layer deposition for programmable device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Utilizing atomic layer deposition for programmable device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Utilizing atomic layer deposition for programmable device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3434662