Utilize ultrasonic energy to reduce the initial contact forces i

Details Utilize ultrasonic energy to reduce the initial contact forces i Utilize ultrasonic energy to reduce the initial contact forces i

1998-02-23

2000-04-04

Ryan, Patrick

Metal fusion bonding

Process

Using high frequency vibratory energy

228 11, 228 447, 2281791, B23K 2010

Patent

active

060450266

ABSTRACT:
A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

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